| 公司名称 | 惠州市惠阳爱特电子有限公司 | 版本 | B0 | ||
| 文件名称 | 制程能力Process capability | 修订日期 | 2025.4.1 | ||
| 序号No. | 流程Technological process | 详述Detailed | 量产能力Production capacity | ||
| 1 | 开料(Material cutting) | 补强类开料精度(Cutting precision) | ±0.2mm | ||
| 2 | 钻孔(Drilling) | 钻孔孔径公差(Aperture tolerance) | ±0.05mm | ||
| 钻孔位置公差(Hole position tolerance) | ±0.05mm | ||||
| 钻咀尺寸(Nozzle size) | 0.1mm～6.5mm | ||||
| 3 | 沉铜/板镀(copper deposition/copper plating) | 孔径纵横比（板厚比孔径，软硬结合板类）Aperture aspect ratio(thickness ratio aperture) | 10:1 | ||
| 盲孔径纵横比(Aspect ratio of blind hole) | 0.8:1 | ||||
| 孔铜厚(Maximum thickness for hole copper) | ±5um | ||||
| 4 | 线路（曝光、DES）(Circuit (exposure, DES)) | 图形对位公差(Graphic alignment tolerance) | 偏移量≤0.03mm(Offset ≤0.03mm) | ||
| 最小线宽/线距控制(Minimum line width) | 完成面铜厚:12-18um (Finish copper thickness :12-18um) | W/S：2.0/2.0mil±10% | |||
|
完成面铜厚18-35um (The copper thickness of the finished surface is 18-35um) |
W/S：4/4mil±10%
|
||||
| 完成面铜厚35-50um (The copper thickness of the finished surface is 35-50um) | W/S：5/5mil±10% | ||||
|
完成铜厚50-70um |
W/S：7/7mil±10% | ||||
| 手指Pitch公差（首尾两PIN）(Finger Pitch tolerance ) |
0≤Pitch≤30mm ±0.05mm
30<Pitch≤50mm ±0.08mm
50<Pitch≤100mm ±0.12mm
|
||||
| 5 | 贴合覆盖膜(Fit covering film) | 覆盖膜累计公差（包括偏位、溢胶、尺寸公差等）(Cumulative tolerance of covering film (including deflection, overflow, size tolerance, etc.)) | 人工：±0.20mm（样品及单批次订单量小于200pnl)(Labor: ±0.20mm (sample and single batch order quantity less than 200pnl)) | 自动贴膜机：±0.10mm（量产单批次订单量大于200PNL或者有特殊要求时使用）(Automatic laminating machine: ±0.10mm (mass production single batch order quantity is greater than 200PNL or has special requirements)) | |
| 颜色(colour) | 黄色、黑色、白色(Yellow, black, white) | ||||
| 最大溢胶量(Maximum overflow) | ≤0.12mm | ||||
| 最小覆盖膜桥宽(Minimum covering membrane width) | ≥0.1mm | ||||
| 保护膜最小方形开窗(Minimum square window with covering film) | 0.5*0.5mm | ||||
| 多层板层间对位精度(Multi-layer board interlayer alignment accuracy) | ≥0.075mm | ||||
| 6 | 表面处理（多种表面处理工艺可以任意搭配在同一个产品上，比如手指做镀镍金、焊盘做沉镍金）Surface treatment (A variety of surface treatment processes can be arbitrarily combined on the same product, such as finger nickel-plated gold, solder pad nickel-sunk gold)) | OSP（外发） | 有机保护膜（抗氧化处理）(Organic protective film (antioxidant treatment)) | ||
|
镍钯金(ENEPIG)
外发(outward processing)
|
Ni：1.0-6.0um
Ba：0.10um Au：0.10um
|
||||
| 镀硬金(Hard gold plating) 外发(outward processing) | Ni：1.0-6.0um Au：0.02um-0.8um | ||||
| 镀软金(Soft gold plating) 外发(outward processing) | Ni：1.0-6.0um Au：0.02um-0.8um | ||||
| 镀软直金（外发）(8/5000Soft gold plating) | Au：0.02um-0.8um | ||||
| 沉镍金(ENIG)内部推荐(Nickel immersed gold (ENIG) internal recommendation) | Ni：80-200U＂ Au：2-4U＂ | ||||
| 沉银(Immersion silver) 外发(outward processing) | Ag：0.1-0.3um | ||||
| 电镀锡(Tin plating) 外发(outward processing) | 2um-15um | ||||
| 7 | 组装（贴合补强/3M胶、缠绕醋酸布） stiffener)(Assembly (laminating /3M adhesive, winding acetate cloth) stiffener)) | 类型(Type) | 规格与厚度(Specifications and thickness) | ||
| FR4 | 厚度(thickness) | 0.1~2.3mm | |||
| 颜色(colour) | 黄色、白色、黑色、绿色（Yellow, white, black, green） | ||||
| 钢片 (steel sheet) | 厚度(thickness) | 0.1~1.0mm | |||
| 类型（type） | 常规304钢片、镀镍钢片（Conventional 304 steel sheet, nickel-plated steel sheet） | ||||
| 铝片 (Aluminum sheet) | 厚度(thickness) | 0.3~2.0mm | |||
| 颜色(colour) | 黑色、银色（Black, silver） | ||||
| PI | 厚度(thickness) | 0.05~0.25mm | |||
| 颜色(colour) | 黑色、褐色、红色（Black, brown, red） | ||||
| 贴合精度（Fitting accuracy） | 人工（Labour） | ±0.15mm | |||
| 设备（equipment） | PI补强机精度：±0.1mm，钢片机精度：±0.05mm（PI reinforcing machine accuracy: ±0.1mm, steel sheet machine accuracy: ±0.05mm） | ||||
| 7 | 阻焊：局部丝印油墨，代替覆盖膜(Solder Mask)（Solder resistance: Solder screen printing ink instead of Solder Mask） | 油墨颜色(Ink color) | 感光油墨（Photosensitive ink） | 白、黑、黄、绿、红、蓝（White, black, yellow, green, red, blue） | |
| 热固油墨（Thermosetting ink） | 白色、黑色（White, black） | ||||
| UV油墨（UV ink） | 白色（white） | ||||
| 最小阻焊桥（Minimum solder resistance bridge） | ≥0.08mm | ||||
| 阻焊油墨厚度(Solder thickness) | 15-35um | ||||
| 字符位置公差 (Position tolerance) | 人工（Labour） | ±0.15mm | |||
| 设备（equipment） | ±0.1mm | ||||
| 字体规格（Font specification） | 丝印字体宽度（Screen printing font width） | ≥0.075mm | |||
| 丝印自高（Screen printing from high） | ≥0.4mm | ||||
| 8 | 电测（Electrical measurement） | 最小测试pad（Minimum test pad） | 测试机Pad/Putch(mm）（Test machine Pad/Putch(mm) | 0.2/0.2mm | |
| 飞针测试Pad/Putch(mm）(Flying needle test Pad/Putch) | 0.1/0.2mm | ||||
| 四线专用测试机(FOUR WIRE MILLI-RESISTANCE TESTER） | 阻值测试范围及精度(Resistance test range and accuracy) | 0.3mΩ-100Ω(精度Test Accuracy:±/0.3mΩ) | |||
| 电感测试机(Inductance tester) | 电感测试范围及精度(Inductance test range and accuracy) | ||||
| 9 | 尺寸公差（Dimensional tolerance） | 插拔金手指偏位公差Offset tolerance of gold finger | 0.3pith值规格（0.3pith value Specifications） | ±0.05mm | |
| 0.5pith值规格（0.5pith value Specifications） | ±0.1mm | ||||
| 单板尺寸公差（Veneer dimensional tolerance） | 0<L≤100mm ： | ±0.05mm | |||
| L:长度大于100mm（L: The length is greater than 100mm） | ±0.1%mm | ||||
| SET出货产品SMT四个角mark点图形位置公差（SET shipment product SMT four corners mark point graphic position tolerance） | 首样（First sample） | 单双面板：±0.1mm,多层板：±0.2mm(Single and double panel: ±0.1mm, multi-layer board: ±0.2mm) | |||
| 返样及量产（Sample return and mass production） | 单双面板：±0.075mm,多层板：±0.1mm(Single and double panel: ±0.075mm, multi-layer board: ±0.1mm) | ||||
| 10 | 阻抗(Impedance) | 阻抗公差(Impedance tolerance) | 查分、特性（Check points, characteristics) | 标准值±10%(Standard value ±10%) | |
| 11 | 产品性能检测(Product performance testing) | 热冲击、焊盘可焊性、剥离强度、耐弯折测试、尺寸测量、二次元尺寸测量（Thermal shock, pad weldability, peel strength, bending resistance test, dimensional measurement, secondary dimensional measurement） | |||
| 12 | 外观品质标准(Appearance quality standard) | 参考IPC6013/IPC600/华为外观检验标准（See IPC6013, IPC600, and Huawei appearance inspection standards） | |||
0752-3627015
aitefpc@aifpc.com
在线留言